Various FOUP/FOSB was developed to maintain and to improve the high throughput of the semiconductor manufacture by washing FOUP and FOSB and HNM-300 of washing and a possible drying treatment was developed with one device.
The change and the arrangements changing of any process kit are also unnecessary in this one device.
- Throughput doubling (our old model and comparison)
- Conserve footprint (no other putting subunit)
- Superprecision washing by nozzle washing method
- Complete dryness by “Hot air knife method” and “High-speed spin method”
- Dust removal and countermeasure against static electricity equipped with fan filter unit and ionizer
- Work space securing for container separation and union
- Automatic purge function for bacteria generation prevention
- High operativeness with touch panel
- High safety is secured by abundant interlock equipping